CIVEN provides ultra-thick electrolytic copper foil with excellent physical properties of equiaxial fine crystal, low profile, high strength and high elongation. (See Table 1)
| Classification | Unit | 9μm | 12μm | 18μm | 35μm | 70μm | 105μm | |
| Cu Content | % | ≥99.8 | ||||||
| Area Weigth | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | 585±10 | 875±15 | |
| Tensile Strength | R.T.(23℃) | Kg/mm2 | ≥28 | |||||
| H.T.(180℃) | ≥15 | ≥18 | ≥20 | |||||
| Elongation | R.T.(23℃) | % | ≥5.0 | ≥6.0 | ≥10 | |||
| H.T.(180℃) | ≥6.0 | ≥8.0 | ||||||
| Roughness | Shiny(Ra) | μm | ≤0.43 | |||||
| Matte(Rz) | ≤3.5 | |||||||
| Peel Strength | R.T.(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.5 | ≥2.0 |
| Degraded rate of HCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||||
| Change of color(E-1.0hr/200℃) | % | Good | ||||||
| Solder Floating 290℃ | Sec. | ≥20 | ||||||
| Appearance(Spot and copper powder) | ---- | None | ||||||
| Pinhole | EA | Zero | ||||||
| Size Tolerance | Width | mm | 0~2mm | |||||
| Length | mm | ---- | ||||||
| Core | Mm/inch | Inside Diameter 79mm/3 inch | ||||||
Applicable to the manufacture of high-power circuit boards and high-frequency boards for automotive, electric power, communication, military and aerospace.
Comparison with similar foreign products. 1.The grain structure of our VLP electrolytic copper foil is equiaxed fine crystal spherical; while the grain structure of similar foreign products is columnar and long. 2. Electrolytic copper foil is ultra-low profile, 3oz copper foil gross surface Rz ≤ 3.5µm; while similar foreign products are standard profile, 3oz copper foil gross surface Rz > 3.5µm.1.Since our product is ultra-low profile, it solves the potential risk of the line short circuit due to the large roughness of the standard thick copper foil and the easy penetration of the thin insulation sheet by the "wolf tooth" when pressing the double-sided panel. 2.Because the grain structure of our products is equiaxed fine crystal spherical, it shortens the time of line etching and improves the problem of uneven line side etching. 3, while having high peel strength, no copper powder transfer, clear graphics PCB manufacturing performance.